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Magazine Name : Ieee Transactions On Electronics Packaging Manufacturing

Year : 2002 Volume number : 25 Issue: 04

Cost And Performance Analysis For Mixed-Signal System Implementation : System -On-Chip Or System -On-Package? (Article)
Subject: Design
Author: Meigen Shen     
page:      162 - 272
A New Bumping Process Using Lead-Free Solder Paste (Article)
Subject: Lead-Ffree
Author: Toshiharu Sugawara      K. Saito1     
page:      253 - 256
Thermal And Mechanical Stability Of Soldering Qfp With Sn -Bi-Ag Lead-Free Alloy (Article)
Subject: Heat Exposure
Author: Katsuaki Suganama     
page:      257 - 261
Process Development And Adhesion Behavior Of Electroless Copper On Liquid Crystal Polymer (Lcp) For Electronic Packaging Application (Article)
Subject: Liquid Crystals
Author: L.H Chen     
page:      273 - 278
Pressure-Assisted Low-Temperature Sintering Of Silver Paste As An Alternative Die-Attach Solution To Solder Reflow (Article)
Subject: Fatigue
Author: Zhang Zhiye     
page:      279 - 288
An Investigation On Thermal Reliability Of Underfilled Pbga Solder Joints (Article)
Subject: Bga , Coarsened Grain
Author: Zhang Liji     
page:      284 - 288
Development Of Lead Free Wave Soldering Process (Article)
Subject: Lead-Free Solder
Author: Minna Arra     
page:      289 - 299
Characterization Of Lead-Free Solders And Under Bump Metallurgies For Flip-Chip Package (Article)
Subject: Meta-Analysis
Author: Jong-Kai Lin     
page:      300 - 307
A Computational Study On Solder Bump Geometry, Normal, Restoring , And Filled Forces During Solder Reflow In The Presence Of Liquefied Underfill (Article)
Subject: Fillet Forces
Author: Y Zhang     
page:      308 - 317
Solder Parameter Sensitivity For Csp Life-Time Prediction Using Simulation-Based Optimization Method (Article)
Subject: Constitutive Model
Author: Bart Vandevelde     
page:      318 - 325
An Integrated Process Modeling Methodology And Module For Sequential Multilayered Substrate Fabrication Using A Coupled Cure-Thermal-Stress Analysis Approach (Article)
Subject: Cure
Author: E Dunne     
page:      326 - 334
The Absorbtion Ink Transfer Mechanism Of Gravure Offset Printing For Electronic Circuitry (Article)
Subject: Ceramics
Author: Marko Pudas     
page:      335 - 343
Encapsulation Process Development For Flexible-Circuit Based Chip Scale Packages (Article)
Subject: Curing
Author: C. Yang     
page:      344 - 354
Electrode Stricking During Micro-Resistance Welding Of Thin Metal Sheets (Article)
Subject: Resistance
Author: S.J. Dong     
page:      355 - 361