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Magazine Name : Ieee Transactions On Electronics Packaging Manufacturing
Year : 2002Volume number : 25Issue:04
Cost And Performance Analysis For Mixed-Signal System Implementation : System -On-Chip Or System -On-Package?(Article) Subject:
Design
Author:
Meigen
Shen
page:
162
-
272
A New Bumping Process Using Lead-Free Solder Paste(Article) Subject:
Lead-Ffree
Author:
Toshiharu
Sugawara
K.
Saito1
page:
253
-
256
Thermal And Mechanical Stability Of Soldering Qfp With Sn -Bi-Ag Lead-Free Alloy(Article) Subject:
Heat Exposure
Author:
Katsuaki
Suganama
page:
257
-
261
Process Development And Adhesion Behavior Of Electroless Copper On Liquid Crystal Polymer (Lcp) For Electronic Packaging Application(Article) Subject:
Liquid Crystals
Author:
L.H
Chen
page:
273
-
278
Pressure-Assisted Low-Temperature Sintering Of Silver Paste As An Alternative Die-Attach Solution To Solder Reflow(Article) Subject:
Fatigue
Author:
Zhang
Zhiye
page:
279
-
288
An Investigation On Thermal Reliability Of Underfilled Pbga Solder Joints(Article) Subject:
Bga
,
Coarsened Grain
Author:
Zhang
Liji
page:
284
-
288
Development Of Lead Free Wave Soldering Process(Article) Subject:
Lead-Free Solder
Author:
Minna
Arra
page:
289
-
299
Characterization Of Lead-Free Solders And Under Bump Metallurgies For Flip-Chip Package(Article) Subject:
Meta-Analysis
Author:
Jong-Kai
Lin
page:
300
-
307
A Computational Study On Solder Bump Geometry, Normal, Restoring , And Filled Forces During Solder Reflow In The Presence Of Liquefied Underfill(Article) Subject:
Fillet Forces
Author:
Y
Zhang
page:
308
-
317
Solder Parameter Sensitivity For Csp Life-Time Prediction Using Simulation-Based Optimization Method(Article) Subject:
Constitutive Model
Author:
Bart
Vandevelde
page:
318
-
325
An Integrated Process Modeling Methodology And Module For Sequential Multilayered Substrate Fabrication Using A Coupled Cure-Thermal-Stress Analysis Approach(Article) Subject:
Cure
Author:
E
Dunne
page:
326
-
334
The Absorbtion Ink Transfer Mechanism Of Gravure Offset Printing For Electronic Circuitry(Article) Subject:
Ceramics
Author:
Marko
Pudas
page:
335
-
343
Encapsulation Process Development For Flexible-Circuit Based Chip Scale Packages(Article) Subject:
Curing
Author:
C.
Yang
page:
344
-
354
Electrode Stricking During Micro-Resistance Welding Of Thin Metal Sheets(Article) Subject:
Resistance
Author:
S.J.
Dong
page:
355
-
361